Package on Package (PoP) Assembly, Inspection & Rework interactive CD-ROM

The industrys first PoP Package assembly training material, the format choice is yours, interactive CD-ROM, on line training session or hands on seminar for groups of engineering staff at your facility? We are currently creating an interactive CD-ROM to complement our workshop and inspection criteria posters.

Find out about design requirements of PoP Footprints

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and, with it, placing further demands on assembly engineers. In simple terms PoP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. PoP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy and Z height control, process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.

Topics covered on CDinclude:

What is Package on Package (PoP)? Benefits of PoP Stack Packages Component Standards Component Types JEDEC Standards PCB Design Rules Pad Layout Via Hole Connection Lead-Free Assembly Engineering Interviews Stencil Printing POP Placement Tack Flux

Dip Solder Paste Reflow Soldering PoP Packages Convection Vapour Phase Temperature Profiling Inspection Optical Inspection X-ray inspection Underfill Rework Package on Package Defects Find out what the CD-ROM covers from Bob Willis

The CD-ROM is £99 plus VAT

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