Date:Monday, October 01, 2012
Time:14:30
Cost:£65.00

Details:

Surface Mount Technology (SMT) is part of mainstream electronic assembly with virtually all market sectors benefiting from the use of SMT. One problem that has always proved an issue to design and process engineers is the use of existing through hole components where no direct equivalent SMT parts are available.  Hence the interest in pin in paste, intrusive reflow, multi spot soldering, regardless of the name it’s a perfect option to eliminate the wave soldering process.

Bob produced the world's first training video, interactive CD-ROM, inspection standards and manual on intrusive reflow. His unique micro video clips provide an ideal way of understanding the technology and how to succeed. Selective soldering can provide excellent results but requires capital equipment investment. One method of soldering all surface mount and through hole components in a single operation is Pin-In-Hole-Reflow which simplifies the manufacturing process.

With this webinar you will also receive a copy of Bob's new book on Pin In Hole Reflow Design and Assembly produced with BR Publishing/PCB007

The webinar will last for approximatly 60-90min with questions

Presented by Bob Willis

Topics covered:
Pin In Hole Assembly Process
PCB Design and Component Requirements
PIHR Advantages and Disadvantages
Stencil Aperture Calculations
Stencil Design Rules
Reflow Soldering Profiles for Convection & Vapour Phase
Common Process Problems
Defect Guide Causes and Cures
Reliability of through hole joints

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Cost excludes VAT which will be added at Checkout

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